You are here:

Laptop Service Centers in Chennai

Hp Graphics Rework

Laptopstore have solutions for all your Hp laptop BGA (Green Chip) Graphics rework and repair needs. Laptopstore're equipped with top-of-the line BGA Graphics rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework.

Laptopstore offer a wide variety of services including Hp laptop BGA Graphics component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.

HP laptop BGA Graphics Component Removal and Replacement -

Laptopstore have top-line Hp laptop BGA graphics rework systems and a fully trained staff of engineers and operators to support you. This combination provides you with a repeatable process with every project meeting the highest quality standards.

Laptopstore're recognized as an industry leader in Hp Laptop BGA graphics services. Whether you have one board or one thousand boards for rework, Laptopstore're the company to turn to for BGA graphics rework services.


One of the problems with BGA Graphics devices is that it is not possible to view the soldered connections using optical methods. Therefore sufficient heat must be applied to ensure that all the balls in the grid melt sufficiently for every joint to be satisfactorily made.

The joints cannot be tested fully by checking the electrical performance. It is possible that the joint may not be adequately made and that over time it will fail. The only satisfactory means of inspection is to use X-ray inspection as this means of inspection is able to look through the device at the soldered joint beneath. It is found that once the heat profile for the solder machine is set up correctly, the BGA graphic rework devices solder very Laptopstorell and few problems are encountered, thereby making BGA assembly possible for most applications.

 

Ball Grid Array, BGA rework:
It is not easy to rework boards containing BGAs unless the correct equipment is available. If a BGA is suspected as being faulty, then it is possible to remove the device. This is achieved by locally heating the device to melt the solder underneath it.

In the BGA graphics rework process, the heating is often achieved removed in a specialized rework station. This comprises a jig fitted with infrared heater, a thermocouple to monitor the temperature and a vacuum device for lifting the package. Great care is needed to ensure that only the BGA is heated and removed. Other devices nearby need to be affected as little as possible otherwise they may be damaged.

Hp laptop BGA Graphics repair:

Once removed, the BGA Graphics can be replaced with a new one. Occasionally it may be possible to refurbish or repair a BGA that has been removed. This BGA repair may be an attractive proposition if the chip is expensive and it is known to be a working device once removed. Undertake a BGA repair it needs to have the solder balls replaced. This BGA repair can be undertaken using some of the small ready-made solder balls that are manufactured and sold for this purpose. Laptop Store has a vast experience both in repairing and also in replacing the faulty BGA connections.